European semiconductor leader STMicroelectronics has announced a major milestone in its partnership with SpaceX, having delivered over 5 billion radio frequency antenna chips for the Starlink satellite internet user terminals. Company executives also project this delivery volume could double in the coming two years, underscoring the massive scale of the Starlink deployment.

STMicroelectronics has been a key chip supplier to SpaceX since 2015. The chips supplied are based on specialized BiCMOS (SiGe) technology, which combines the high speed and gain of bipolar transistors with the low power consumption of CMOS. This makes them ideal for the demanding, radiation-tolerant environment of space, perfectly matching the needs of Starlink terminals. With Starlink now serving over 8 million users across more than 150 countries, demand continues to surge. The company estimates total chip deliveries could surpass 10 billion units by 2027.

The partnership extends to the most advanced technology. In November 2025, STMicroelectronics launched the STM32V8, the industry's first 18nm high-performance microcontroller. Utilizing 18nm FD-SOI process technology and featuring embedded Phase-Change Memory (PCM), a 4MB non-volatile memory, and an 800MHz Arm Cortex-M85 core, it is the most powerful STM32 series to date. This chip is already being used by SpaceX in the Starlink satellite laser system for its high-performance real-time processing capabilities.

This technological collaboration occurs as SpaceX itself prepares for a monumental move. The company is planning an Initial Public Offering (IPO) in mid-to-late 2026, targeting a valuation of $1.5 trillion. If successful, it would be the largest IPO in global history, expected to raise over $30 billion. The funds will partly fuel projects like space-based data centers, driving further demand for specialized semiconductors.

ICgoodFind's Insight
The massive, sustained volume of chips flowing from ST to SpaceX highlights how commercial space ventures are becoming a major, high-reliability driver for the semiconductor industry. It validates investments in specialized, radiation-hardened technologies and underscores the deep integration of advanced silicon in next-generation infrastructure.